80% Tungsten Sputtering Target Supplier
For tungsten carbide sputtering targets, it is recommended that these materials be bonded. Many materials have properties that make them unsuitable for sputtering, such as brittleness and low thermal conductivity. This material may require special procedures. Other materials may not require this process. Target materials with low thermal conductivity are susceptible to thermal shock.
80% Tungsten Sputtering Target factpry
Application
•Chemical Vapor Deposition (CVD)
•Physical Vapor Deposition (PVD)
•Semiconductors
•Optics
Manufacturing process
•Manufacturing - cold pressing - sintering, elastomer bonded to backing plate
•Cleaning and final packaging, used for vacuuming after cleaning
99.95%Tungsten Sputtering Targets
